Substrate Cutting System KSM-35
A circuit board separation system that minimizes stress on the implemented components.
■ By manufacturing jigs based on mechanical design standards, there is no damage to parts due to contact with the jigs or separation. ■ Even with many bridge sections present, our developed board separation device has a high output, allowing for minimal stress during separation. ■ The bridge sections are punched out with a specially shaped punch, resulting in a clean finish on the separation surface. ■ The punched bridge sections are designed to fall beneath the jig, and the use of special punch blades minimizes the dust generated during board punching. ■ By using the board separation device we have developed in conjunction with existing operations, we achieve improved work efficiency, cost reduction, and reduced environmental impact compared to conventional methods. ■ By changing the board separation jig, it can accommodate various types of boards. ■ Safety design incorporating area sensors for the separation section. ■ Both an easy-to-use touch panel and a two-handed push button for safety considerations are adopted.
